芯片定位装置以及芯片定位方法

Chip positioning device and chip positioning method

Abstract

本发明公开了一种芯片定位装置以及芯片定位方法。芯片定位装置用于倒装型多层陶瓷电容器的芯片的封端定位,包括:设置有多个均匀排列的第一通孔的第一导板,第一通孔的长度与芯片的宽度相匹配;设置有多个均匀排列的第二通孔的第二导板,第二通孔的数量和分布位置与第一通孔匹配,第二通孔的长度与第一通孔的长度相等,第二通孔的宽度与芯片的厚度相匹配;设置有多个均匀排列的第三通孔的定位板,第三通孔的数量和分布位置与第二通孔匹配,第三通孔的长度和宽度与第二通孔的长度和宽度相等。这种芯片定位装置和芯片定位方法,能保证倒装型多层陶瓷电容器的芯片在封端时定位取向正确,能够提高封端效率,并且操作较为方便。
The invention discloses a chip positioning device and a chip positioning method. The chip positioning device is used for end packaging positioning of chips of an inversion-type multilayer ceramic capacitor. The chip positioning device comprises a first guide plate provided with a plurality of uniformly-arranged first through holes, wherein the length of each first through hole is matched with the width of each chip; a second guide plate provided with a plurality of uniformly-arranged second through holes, wherein the number and distribution positions of the second through holes are matched with those of the first through holes, the length of each second through hole is equal to that of each first through hole, and the width of each second through hole is matched with the thickness of the chip; and a positioning plate provided with a plurality of uniformly-arranged third through holes, wherein the number and distribution positions of the third through holes are matched with those of the second through holes, the length and width of each third through hole are equal to the length and width of each second through hole. The chip positioning device and the chip positioning method can ensure correct positioning orientation of the chips of the inversion-type multilayer ceramic capacitor during end packaging, can improve end packaging efficiency and is convenient to operate.

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