一种传感器模块及其制作方法

Sensor module and manufacturing method thereof

Abstract

The embodiment of the invention discloses a sensor module and a manufacturing method thereof. The method comprises the following steps: setting a sensor chip on a substrate at a set position; setting a preset cavity structure at the set position on the periphery of the sensor chip, wherein the preset cavity structure is used for dividing the upper surface of the substrate into a first area including the sensor chip and a second area on the periphery of the first area; packaging the second area by a first rubber matrix; and packaging the first area. According to the sensor module and the manufacturing method thereof, the preset cavity structure is arranged on the periphery of the sensor chip, and the substrate is divided into the first area including the sensor chip and the second area on the periphery of the first area, so that the two areas are packaged by using different rubber matrixes respectively, and the problems of long mold manufacturing period, modification inconvenience, high cost and the like caused by a pre-mold opening technology since the substrate is divided into the two areas by using a mold manufactured by the pre-mold opening technology in the prior art are solved.
本发明实施例公开了一种传感器模块及其制作方法,该方法包括:将传感器芯片以设定位置设置于基板上;在所述传感器芯片外围的设定位置处设置预置空腔结构,其中,所述预置空腔结构将基板上表面分割为包括所述传感器芯片的第一区域,以及所述第一区域外围的第二区域;将所述第二区域通过第一胶体封装;将所述第一区域进行封装。本发明实施例通过在传感器芯片周围设置预设空腔结构,实现将基板分割为包括传感器芯片的第一区域以及第一区域外围的第二区域,从而实现利用不同的胶体分别对两个区域进行封装,解决了现有技术中利用预开模工艺制作的模具将基板分割为两个区域,由于预开模工艺造成的模具制作周期长、修改不方便以及成本高等问题。

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