电抛光和多孔化

Electro-polishing and porosification

Abstract

本发明公开了在硅基板上形成多孔层的方法。形成所述多孔层可包括:将硅基板置于第一溶液中,并传导第一电流通过所述硅基板。所述方法还可包括传导第二电流通过所述硅基板,从而在所述硅基板上产生多孔层。
Forming a porous layer on a silicon substrate is disclosed. Forming the porous layer can include placing a silicon substrate in a first solution and conducting a first current through the silicon substrate. It can further include conducting a second current through the silicon substrate resulting in a porous layer on the silicon substrate.

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